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In today's pursuit of higher clarity and superior display effects, LED display technology is developing at an unprecedented speed. Among them, COB (Chip on Board) inverted LED technology is gradually becoming a brilliant new star in the field of display technology due to its unique packaging method, excellent display effect, and wide application prospects. As an innovative display technology, COB inverted LED not only directly packages LED chips on PCB substrates, achieving a more compact structure and higher reliability, but also brings unprecedented visual experience to users through its excellent optoelectronic performance. This article will delve into the technical characteristics, advantages, and applications of COB inverted LED in various fields, taking you to appreciate the charm of this revolutionary display technology.

 

1、 Technical features

Packaging method:

COB inverted LED is a technology that directly encapsulates LED chips on a PCB substrate, without the need for brackets or solder paste, and adheres them to the PCB board through adhesive bonding technology.

Compared with traditional SMD (Surface Mount Device) packaging, inverted COB technology omits brackets and solder paste, resulting in a simpler structure.

 

Chip orientation:

The LED chip of the inverted COB is directly connected to the PCB substrate with its solder joints facing downwards, without the need for leads.

This increases the reliability of the product, improves the luminous effect, and allows for smaller dot spacing.

2、 Advantages

High reliability:

Inverted COB adopts fully inverted light-emitting chips and solderless packaging technology, reducing the soldering area and solder joints, and improving the stability and performance of the product.

 

Excellent protective performance:

Featuring features such as collision resistance, shock resistance, waterproofing, dust prevention, smoke prevention, and anti-static, it enhances the durability and safety of display devices.

 

Excellent display effect:

The thickness of the encapsulation layer is further reduced, which solves the problem of colored and dark lines between the COB modules in the formal installation.

Supports HDR digital image technology, providing ultra-high contrast, high brightness, and high resolution, making the display effect clearer and more vivid.

 

Compact size:

Inverted COB is a true chip level package that does not require wiring, and its physical space size is only limited by the size of the light-emitting chip.

Suitable for application scenarios with pixel spacing below 1.0, it can achieve smaller pixel spacing and higher display resolution.

 

Energy saving and comfortable:

Under the same brightness conditions, power consumption is reduced by 45%.

The unique heat dissipation technology makes the surface temperature of the screen 10 ℃ lower than that of conventional LED display screens, making it more suitable for near screen experience applications.

3、 Manufacturing process

 

Chip detection and classification:

Quality inspection and performance grading of LED light-emitting chips.

Classify chips based on various parameters such as display brightness, wavelength, voltage, etc., to ensure that the subsequent use of light-emitting chips meets the standards.

 

PCB substrate cleaning:

Before starting the packaging process, thoroughly clean the PCB substrate to remove impurities such as dust and oxide layers.

To ensure good adhesion and electrical connection.

 

Drip adhesive:

Drip adhesive at specific locations on the PCB board to secure the LED light-emitting chip.

The selection of adhesive and the amount of dripping need to be precisely controlled to ensure the firmness of the chip and the smooth progress of subsequent processes.

 

Chip pasting:

Paste the sorted LED light-emitting chips face down (inverted) according to the predetermined pattern and pixel spacing onto the PCB substrate coated with adhesive.

This process requires extremely precise positioning.

 

Electrode connection:

Connect the electrodes of the chip to the solder pads on the PCB substrate using gold or copper wires.

This process requires ensuring the transmission of electrical signals.

 

Cover protective layer:

Cover the light-emitting chip and soldering circuit with a layer of hard polymer material coating.

It plays a role in protecting the chip, preventing external environmental influences, improving heat dissipation performance, and increasing the flatness of the screen surface.

This step involves a heating and curing process to ensure that the surface material is completely hardened.

 

Testing and repair:

Conduct preliminary testing after solidification to ensure the normal operation of chip functionality.

After sealing, functional and optoelectronic performance tests are conducted, including display brightness, color consistency, and defect detection.

Screen out non-conforming products and repair or replace problematic units accordingly.

 

Cleaning and testing:

Clean the finished product and remove excess foreign objects.

Conduct final appearance and functional testing.

4、 Application scenarios

Indoor application:

COB technology is widely used in the indoor specialty display industry due to its high reliability, large viewing angle, and face off light source characteristics.

Mainly used in government, military, broadcasting, traffic command, energy industry and other fields.

 

Outdoor applications:

With the continuous decrease in costs, COB technology has also begun to enter outdoor display applications.

Such as outdoor billboards, stage backgrounds, etc.

 

Integrated machines and television industry:

The all-in-one machine and television industry with COB as the panel have also begun to rise rapidly.

COB technology provides these industries with higher quality display effects and more stable performance.

COB inverted LED technology occupies an important position in the LED display market with its unique advantages and wide application scenarios. With the continuous advancement of technology and further cost reduction, COB inverted LED technology is expected to be applied and promoted in more fields.